Analysis

Whether developing a clean sheet design from the ground up or working through an unexpected design challenge, we’re here to help with your thermal and structural analysis needs.

Thermal Analysis (FEA/CFD)

  • Conduction Cooled Electronics Assemblies
  • Natural and Forced Convection (Fan & Plenum Fed) Cooled Electronics
  • High Altitude Effects (Avionics Applications)
  • Solar Loading and Radiative Cooling
  • Transient Thermal Analysis
  • High Current Applications
  • Thermo-Electric Coolers (TECs)
  • Heat Pipes / Vapor Chambers
  • Digital Twin Development and Validation

Structural Mechanics (FEA)

  • Static Loading
  • Modal Analysis
  • Sinusoidal, Random and Sine-on-Random Vibration Response
  • Shock Response
  • Fatigue Life Estimation
  • Thermal Expansion and Contraction (CTE)
  • Temperature Dependent Material Properties

Board Level Reliability Considerations

  • Plated-Thru-Hole (PTH) reliability (IPC-TR-579 / IPC-TM-650)
  • Solder joint reliability (IPC D-279 / IPC-9701)
  • Component/board (CTE) mismatch and mitigation
  • Electromagnetic Interference (EMI) Susceptibility, Coupling and Mitigation

Analysis Software Experience

SolidWorks Simulation • SolidWorks Flow Simulation • ANSYS Mechanical • ANSYS Fluent • ANSYS IcePak • FloTherm (Mentor Graphics) • Nastran/Patran (MSC)