Analysis

Whether developing a clean sheet design from the ground up or working through an unexpected design challenge, we’re here to help with your thermal and structural analysis needs.

Thermal Analysis (FEA/CFD)

• Systems Thermal Management
• Conduction Cooled Electronics Assemblies
• Natural and Forced Convection (Fan & Plenum Fed) Cooled Electronics
• High Altitude Effects (Avionics Applications)
• Solar Loading Effects and Radiative Cooling
• Transient Thermal Analysis
• High Current Applications
• Thermo-Electric Coolers (TECs)
• Heat Pipes / Vapor Chambers
• Thermal Resistance Networks
• Digital Twin Development and Validation

Structural Mechanics (FEA)

• Static Loading
• Modal Analysis
• Sinusoidal, Random and Sine-on-Random Vibration Response
• Shock Response
• Fatigue Life Estimation
• Thermal Expansion and Contraction (CTE)
• Temperature Dependent Material Properties

Board Level Reliability Considerations

• Plated-Thru-Hole (PTH) reliability (IPC-TR-579 / IPC-TM-650)
• Solder joint reliability (IPC D-279 / IPC-9701)
• Component/board (CTE) mismatch and mitigation
• Electromagnetic Interference (EMI) Susceptibility, Coupling and Mitigation

Analysis Software Experience

SolidWorks Simulation • SolidWorks Flow Simulation • ANSYS Mechanical • ANSYS Fluent • ANSYS IcePak • FloTHERM • Nastran/Patran (MSC)